Rigid PCB
Materials: | PTFE Multilayer, Halogen Free, Rogers, Hybrid Material, Aluminum Base, Heat Sink PCB, PPO, Ceramic based, Mixed Materials (Rogers +FR4). |
Max. Layers: | 56L Mass production (60L on development) |
Min Line/Space: | Inner Layer 3/3 mil (we can provide samples 2/2) |
Out layer 4/3mil (we can provide samples with 3/3 mil) | |
Finished thickness: | 400mil (10mm) |
Min. Mechanical hole: | 8 mil (0.2mm) |
Min. Laser drill hole: | 3 mils(0.075mm) |
Max. aspect ratio: | 18:1 |
Max. panel size: | 43 ² X 24 ²(1100 X610mm) |
Buried resistor: | we can provide mass production of PCB with buried resistors |
Buried capacitance: | we can provide mass production of PCB with buried capacitance |
Controlled impedance: | +/- 5% |
HDI : | 2+C+2 |
Surface finishing: | HASL. Immersion Gold, Gold finger, OSP, Immersion Tin, Immersion Silver |